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UIC Advanced Process LaboratoryThe Advanced Process Laboratory (APL) is a process development, analytical services, and research provider to the electronics industry.
http://www.uic-apl.com/
The Advanced Process Laboratory (APL) is a process development, analytical services, and research provider to the electronics industry.
http://www.uic-apl.com/
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Universal Instruments Corp.
Greg Benoit
33 Broom●●●●●●●●ate Pkwy
Co●●in , New York, 13748
United States
View this contact
Universal Instruments Corp.
Greg Benoit
33 Broom●●●●●●●●ate Pkwy
Co●●in , New York, 13748
United States
View this contact
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UIC Advanced Process Laboratory | uic-apl.com Reviews
https://uic-apl.com
The Advanced Process Laboratory (APL) is a process development, analytical services, and research provider to the electronics industry.
uic-apl.com
2003 Reports - UIC Advanced Process Laboratory
http://www.uic-apl.com/reports/2003-reports
2016 - Research Plan. 2015 - Research Plan. 2014 - Research Plan. October 26-27, AREA Meeting. Evolution of Voids in a Thermal Interface Material During Cure. Authors: Shafi Saiyed, K. Srihari and Peter Borgesen. Flow Properties of Gap-Filling Thermal Interface Materials. Author: Laurence A. Harvilchuck. Heat Sink Attach to PBGA Modules. Author: Thomas R. Homa. Printing and Dispensing of Thermal Interface Materials: An Initial Comparison. Authors: Muffadal Mukadam and K. Srihari. Soldering of eutectic Sn...
2010 Reports - UIC Advanced Process Laboratory
http://www.uic-apl.com/reports/2010-reports
2016 - Research Plan. 2015 - Research Plan. 2014 - Research Plan. October 26-27, AREA Meeting. Recrystallization and Precipitate Coarsening in Pb-free Solder Joints during Fatigue Tests. On the Root Cause of Kirkendall Voiding in Cu3Sn. Authors: Liang Yin and Peter Borgesen. Effects of Pre-stressing on Solder Joint Failure by Pad Cratering. Authors: Venkatesh Raghavan, Brian Roggeman, Michael Meilunas and Peter Borgesen. The Effect of Partial Pad Craters on Drop/Shock Reliability. Thermal Cycle Reliabili...
2008 Reports - UIC Advanced Process Laboratory
http://www.uic-apl.com/reports/2008-reports
2016 - Research Plan. 2015 - Research Plan. 2014 - Research Plan. October 26-27, AREA Meeting. Abstract:This document offers a brief summary of our 2008 efforts. Details of the work and results are found in the individual reports or presentations referred to below, or in reports and presentations cited in those. Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging. Effect of Bath Agitation on Voiding in Cu3Sn. Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling.
AREA Consortium Newsletters - UIC Advanced Process Laboratory
http://www.uic-apl.com/process-manuals/newsletters
2016 - Research Plan. 2015 - Research Plan. 2014 - Research Plan. October 26-27, AREA Meeting. Below you will find links to past consortium newsletters. These newsletters are intended to provide our members with periodic updates on research progress. They do not contain significant results or data and may be shared with participating and non-member companies. Check out my work and hire me @ refugeek.com.
AREA Consortium Reports - UIC Advanced Process Laboratory
http://www.uic-apl.com/reports
2016 - Research Plan. 2015 - Research Plan. 2014 - Research Plan. October 26-27, AREA Meeting. He reports placed into the following sites by year are the results of the research conducted by Universal's AREA Consortium and it's funded University efforts. They have been placed in separate years in order to facilitate easier searches when looking for keywords in the "Search this site" window above. You can also perform a search for text on the following list of reports back to 1994. 2014 Master Report List.
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十月 11, 2016. 九月 29, 2016. Universal Brings Odd-Form Capabilities, Technical Know-How to SMTAi. 九月 21, 2016. Complementary technology and process solutions provide foundation for lasting profitability. 九月 12, 2016. SmartTec Showcases Universal’s Fuzion at E-16 Electronics Exhibition in Denmark. 八月 31, 2016. Versatile platform featured in flexible production line promoting cost-effective electronics assembly in Denmark. See Full List of Press Releases. Sign Up for Updates. Send me a message.
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Sign Up for Updates. 2015 Universal Instruments Corporation. Send me a message.
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Sign Up for Updates. 2015 Universal Instruments Corporation. Send me a message.
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VIEW UPCOMING EVENTS CALENDAR. View Golf Event Info. LA/OC SMTA CHAPTER CHAPTER Meeting Announcement October 2016. LA/OC SMTA CHAPTER CHAPTER Meeting Announcement September 2016. LA/OC SMTA CHAPTER CHAPTER Meeting Announcement August 2016. LA/OC SMTA CHAPTER Newsletter July 2016. LA/OC SMTA CHAPTER CHAPTER Meeting Announcement June 2016. LA/OC SMTA CHAPTER Meeting Announcement May 2016. LA/OC SMTA CHAPTER CHAPTER Meeting Announcement April 2016. LA/OC SMTA CHAPTER NEWS LETTER November 2015 ISSUE. LA/OC S...
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UIC Advanced Process Laboratory
2015 - Research Plan. 2014 - Research Plan. October 14th-5th AREA Meeting. AREA Consortium mid-year research project updates will be starting the week of June 22nd. Each session will present the status of several commonly themed projects in an interactive web meeting format. June 23: Laminate Materials. June 25: Solder Paste Printing. June 30: Solder Interconnects. July 02: Die Attach Materials. If you haven't received your members-only meeting invitation, contact jim.wilcox@uic.com. Metallurgical observ...
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Visión – Misión – Objetivo. 1 Seminario y exposición Polo Industrial Zárate – Campana año 2009. 2 Seminario y exposición Polo Industrial Zárate – Campana año 2010. 3 Seminario y exposición Polo Industrial Zárate – Campana año 2011. 4 Seminario y exposición Polo Industrial Zárate – Campana año 2012. 5 Seminario y exposición Polo Industrial Zárate – Campana año 2013. Visión – Misión – Objetivo. 1 Seminario y exposición Polo Industrial Zárate – Campana año 2009. Comité Permanente de Seguridad. Para aumentar...
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