mtlab.fbk.eu

FBK | MTLab

We commit to provide the perfect environment for your micro devices development. Ultra-low leakage planar devices. High purity substrate (FZ). BIAS: resistors or punch-through. Pixel: p-on-n, n-on-n and n-on-p. High purity substrate (FZ). Up to two metal levels per side. Selective n-p column doping. Doped trenches for active edge. Ultra low stress dielectric layers. Metal and polymer sacrificial layer. Wafer-through with multiple levels. Microfluidics chips with glass bonding. 2013 FBK - MTLab.

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FBK | MTLab | mtlab.fbk.eu Reviews

<META> DESCRIPTION

We commit to provide the perfect environment for your micro devices development. Ultra-low leakage planar devices. High purity substrate (FZ). BIAS: resistors or punch-through. Pixel: p-on-n, n-on-n and n-on-p. High purity substrate (FZ). Up to two metal levels per side. Selective n-p column doping. Doped trenches for active edge. Ultra low stress dielectric layers. Metal and polymer sacrificial layer. Wafer-through with multiple levels. Microfluidics chips with glass bonding. 2013 FBK - MTLab.

<META> KEYWORDS

1 search form

2 about us

3 capabilities

4 technology platforms

5 news

6 success stories

7 site map

8 our partners

9 double side processing

10 microstrip ac&dc coupling

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search form,about us,capabilities,technology platforms,news,success stories,site map,our partners,double side processing,microstrip ac&dc coupling,wafer through doped structures,wafer through drie,surface mems,back end module,temperature below 400c

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FBK | MTLab | mtlab.fbk.eu Reviews

https://mtlab.fbk.eu

We commit to provide the perfect environment for your micro devices development. Ultra-low leakage planar devices. High purity substrate (FZ). BIAS: resistors or punch-through. Pixel: p-on-n, n-on-n and n-on-p. High purity substrate (FZ). Up to two metal levels per side. Selective n-p column doping. Doped trenches for active edge. Ultra low stress dielectric layers. Metal and polymer sacrificial layer. Wafer-through with multiple levels. Microfluidics chips with glass bonding. 2013 FBK - MTLab.

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mtlab.fbk.eu

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Success stories | MTLab

http://mtlab.fbk.eu/success-stories

Developement and series fabrication. Optoi s.r.l. Founded in 1995 as a Spin-off of the FBK, Optoi s.r.l. Advansid s.r.l. Incorporated in 2010 as a spin-off of the FBK, Advansid s.r.l. Focuses on promoting on the market silicon photomultipliers developed by SRS. Unit and realized by MTLab. A Large Ion Collider Experiment (ALICE). Alpha Magnetic Spectrometer 02 (AMS). In day 19 may 2011 Space Shuttle Endeavour STS-134 installed the AMS-02. On International Space Station. The experiment has been succesf...

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Capabilities | MTLab

http://mtlab.fbk.eu/activity

All our labs have full 6 inch double side processing capability. For a complete decsription of our capabilities and equipement list please refer to our brochure. FABRICATION LINE CLASS 10-100 CLEANROOM (560m2). Projection lithography: CD 2um, accuracy 1um. Stepping lithography: CD 350nm, accuracy 75nm. MEMS CLASS 100-1000 CLEANROOM (180m2). Projection lithography: CD 1.5um, accuracy 1um. 2013 FBK - MTLab. Via Sommarive, 18 I-38123 Trento e-mail:.

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Contact us | MTLab

http://mtlab.fbk.eu/node/35

Success stories of technology exploitation. Success stories of technology exploitation. Or fill in our online request form. You can reach us using google-maps:. Visualizzazione ingrandita della mappa. 2013 FBK - MTLab. Via Sommarive, 18 I-38123 Trento e-mail:.

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About us | MTLab

http://mtlab.fbk.eu/about-us

Success stories of technology exploitation. Success stories of technology exploitation. Certificato rina 2.pdf. MTLab belongs to the Micro Electro-Mecahnics world. MEMS fabrication has opened new fields for technological development, where the effort is focused on smart exploitation of stabilized technological capability, an approach named More than Moore . Adavnced Photonics and Photovoltaics. MTLab provides the entire development cycle. We focus our expertise. We offer a unique policy. To perform both ...

5

Products | MTLab

http://mtlab.fbk.eu/products

We can coat 6 inch wafers in thickness range between 300-700um, with single or double side coating of the following:. Low stress silicon nitride (10-4000nm). Note: thickness ranges may be extended to meet specific needs. Technology Platform based fabrication. Please refer to the technology platforms. Page to have a look at available technologies. 2013 FBK - MTLab. Via Sommarive, 18 I-38123 Trento e-mail:.

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FBK | MTLab

We commit to provide the perfect environment for your micro devices development. Ultra-low leakage planar devices. High purity substrate (FZ). BIAS: resistors or punch-through. Pixel: p-on-n, n-on-n and n-on-p. High purity substrate (FZ). Up to two metal levels per side. Selective n-p column doping. Doped trenches for active edge. Ultra low stress dielectric layers. Metal and polymer sacrificial layer. Wafer-through with multiple levels. Microfluidics chips with glass bonding. 2013 FBK - MTLab.

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